Data for: In-situ formation of indium seed layer for copper metallization of silicon heterojunction solar cells
| Main Author: | Yu, Jian |
|---|---|
| Format: | Dataset |
| Terbitan: |
Mendeley
, 2019
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| Subjects: | |
| Online Access: |
https:/data.mendeley.com/datasets/65959jk46y |
Daftar Isi:
- Enclosed please find original manuscript and original figures of our article titled " In-situ formation of indium seed layer for copper metallization of silicon heterojunction solar cells". Highlights: An innovative method of copper metallization with in-situ seed layer technique is proposed for SHJ solar cells. The maximum peeling force of plated busbar with In/Ni/Cu stacks reaches 4.23 N, higher than screen-printed silver busbar (2.31 N). The all-solution based plating process requires neither full area seed layer deposition nor subsequent etch back step, showing great potential of low cost SHJ solar cells.