Modeling and design of electromagnetic compatibility for high-speed printed circuit board and packaging
| Main Author: | WEI, Xin-Chang |
|---|---|
| Format: | Book |
| Terbitan: |
CRC Press
, 2017
|
| Subjects: | |
| Online Access: |
https://webpac.lib.itb.ac.id/search/detail/134886 |
Internet
https://webpac.lib.itb.ac.id/search/detail/134886Lokasi
| Koleksi | Katalog UPT Perpustakaan ITB |
|---|---|
| Gedung | Perpustakaan Institut Teknologi Bandung |
| Institusi | Institut Teknologi Bandung |
| Kota | KOTA BANDUNG |
| Provinsi | JAWA BARAT |
| Kontak | Butuh informasi lebih lanjut? Hubungi pustakawan institusi ini. |