Modeling and design of electromagnetic compatibility for high-speed printed circuit board and packaging
| Main Author: | WEI, Xin-Chang |
|---|---|
| Format: | Book |
| Terbitan: |
CRC Press
, 2017
|
| Subjects: | |
| Online Access: |
https://webpac.lib.itb.ac.id/search/detail/134886 |
Daftar Isi:
- xviii, 322 halaman: gambar, tabel; 24 cm.