Printed circuit handbook, fifth edition
| Main Author: | COOMBS, Clyde F. |
|---|---|
| Format: | Book xxxix, 61.9 hlm.; 24 cm. |
| Bahasa: | eng |
| Terbitan: |
McGraw-Hill
, 1996
|
| Subjects: | |
| Online Access: |
http://elib.poltektedc.ac.id//index.php?p=show_detail&id=2671 |
Daftar Isi:
- DAFTAR ISIPart 1 Introduction to Printed CircuitsChapter 1 Electronic packaging and high-density interconnectivityChapter 2 Semiconductor packaging technologyChapter 3 Advanced packagingChapter 4 Types of printed wiring boardsPart 2 MaterialsChapter 5 Introduction to base materialsChapter 6 Base material componentsChapter 7 Base matreial manufacturing processesChapter 8 Properties of base materialsChapter 9 Densification issues for base materialsChapter 10 Introducing base materials into the PCB manufacturing processChapter 11 HDI microvia materialsChapter 12 Laminate qualification and testingPart 3 Engineering and DesignChapter 13 Physical characteristics of PCBChapter 14 The PCB design processChapter 15 Electrical and mechanical design parametersChapter 16 Controlled impedanceChapter 17 Multilayer design issuesChapter 18 Planning for design, fabrication, and assemblyChapter 19 Manufacturing information documentation and transferChapter 20 Electronic contract manufacturing supplier selection and managementPart 4 High-Density InterconnectChapter 21 Introduction to high-density interconnection technologyChapter 22 High-density interconnect-build-up technologiesChapter 23 Microvia hole technologiesPart 5 Fabrication ProcessesChapter 24 Drilling processesChapter 25 High-density interconnect drilingChapter 26 ImagingChapter 27 Multilayer materials and processingChapter 28 Preparing boards for platingChapter 29 ElectroplatingChapter 30 Direct platingChapter 31 PWB manufacture using fully electroless copperChapter 32 Surface finishesChapter 33 Etching process and technologiesChapter 34 Solder resist material and processesChapter 35 Machining and routingChapter 36 Process capability and controlChapter 37 Bare board test objectives and definitionsChapter 38 Bare board test methodsChapter 39 Bare board test equipmentChapter 40 BDI bare board special testing methodsPart 6 AssemblyChapter 41 Assembly processesPart 7 SolderingChapter 42 Design for soldering and solderabilityChapter 43 Solder materials and processesChapter 44 No-clean assembly processChapter 45 Lead-free solderingChapter 46 Fluxes and cleaningChapter 47 Press-fit connectionsPart 8 Quality Control and ReliabilityChapter 48 Acceptability of fabricated boardsChapter 49 Acceptability of printed circuit board assembliesChapter 50 Assembly InspectionChapter 51 Design for testingChapter 52 Loaded board testingChapter 53 Reliability of printed circuit assembliesChapter 54 Component-to PWB reliabilityPart 9 Environmental Issues and Waste TreatmentChapter 55 Process waste minimization and treatmentPart 10 Flexible CircuitsChapter 56 Flexible circuits: application and materialsChapter 57 Design of flexible circuitsChapter 58 Manufacturing of flexible circuitsChapter 59 Termination of flexible circuitsChapter 60 Special construction of flexible circuitsChapter 61 Quality assurance of flexible circuits