Fabrication of SPR chip with multiple air-gaps using SoQ bonding
| Main Authors: | Lee, Yeonsu, Sim, Sung-min, Kang, Hye-Lim, Fontana, Eduardo, Llamas-Garro, Ignacio, Olivera Cavalcanti, Gustavo, Kim, Jung-Mu |
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| Format: | Proceeding Journal |
| Terbitan: |
, 2016
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| Subjects: | |
| Online Access: |
https://zenodo.org/record/826794 |
Daftar Isi:
- SPR effect has been used in a number of applications such as biosensors and food safety sensors [1-2]. In the Otto configuration based SPR chip, a negative effect of the adhesion layer on the SPR quality can be eliminated because of the arrangement of the metal film which is separated from the glass substrate and this characteristic was analyzed a previous study [3]. It is widely known that the air-gap distance of the SPR chip is a very important factor for attaining high sensitivity. In an accurately designed SPR chip, the resonance angle of the SPR curve is shifted perceptively when the target molecule is detected. Thus, if the SPR chip has multiple air-gap distances, multiple SPR effects can be used to detect various target molecules by using a single SPR chip. In this study, an Otto configuration based SPR chip with multiple air-gaps for real-time multiple SPR sensing is proposed and fabricated using the silicon on quartz (SoQ) bonding process. The multiple SPR effect of the proposed SPR chip is analyzed by using FEM simulation.
- Grant numbers : This work was supported by the Spanish Ministry of Economy and Competitiveness project PIB2010BZ-00585 (NANOWAVE), part of this work has been supported by the Generalitat de Catalunya under grant 2014 SGR 1551.