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SPR chip fabrication using silicon-on-quartz bonding

Tersimpan di:
Main Authors: Lee, Yeonsu, Sim, Sung-min, Fontana, Eduardo, Llamas-Garro, Ignacio, Olivera Cavalcanti, Gustavo, Kim, Jung-Mu
Format: Proceeding
Terbitan: , 2015
Subjects:
SPR effect
Kretschmann configuration
Otto configuration
SoQ bonding
FEM simulation
Online Access: https://zenodo.org/record/400207
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Internet

https://zenodo.org/record/400207

Lihat Juga

  • Fabrication of SPR chip with multiple air-gaps using SoQ bonding
    oleh: Lee, Yeonsu, et al.
    Terbitan: (2016)
  • Study on effect of air gap thickness in Otto configuration based SPR chips
    oleh: Lee, Yeonsu, et al.
    Terbitan: (2018)
  • Chip con Resonancia Plasmónica de Superficie con Aplicación en Sensores Ópticos
    oleh: Llamas-Garro, Ignacio, et al.
    Terbitan: (2015)
  • Reflectance ananlysis of the Otto chip using an automated reflectometer
    oleh: Lee, Yeonsu, et al.
    Terbitan: (2018)
  • Otto Chip Vazado como Transdutor de Pressão por Ressonância de Plasmons de Superfície
    oleh: Maciel Neto, J.O., et al.
    Terbitan: (2016)
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