SPR chip fabrication using silicon-on-quartz bonding
| Main Authors: | Lee, Yeonsu, Sim, Sung-min, Fontana, Eduardo, Llamas-Garro, Ignacio, Olivera Cavalcanti, Gustavo, Kim, Jung-Mu |
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| Format: | Proceeding |
| Terbitan: |
, 2015
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| Subjects: | |
| Online Access: |
https://zenodo.org/record/400207 |
Daftar Isi:
- In this paper, an Otto coupling configuration based SPR chip is designed, simulated and fabricated using a silicon-on-quartz (SoQ) bonding process. The simulation of the SPR effect is conducted using COMSOL Multiphysics simulator (Altsoft Co.) using the designed chip dimensions, the optical constants are interpolated from data available in the literature. The size of the fabricated SPR chip is ͵Ͳൈ͵Ͳൈͳ ଷ. Resonance angle and reflectance are measured to be 42.19 degree and 0.411, respectively, using an automated reflectometer. Discrepancy between measurement and simulation results is discussed by optical constant of the gold layer used as a thin metal film. The SoQ bonding process is a feasible approach for implementation of Otto coupling configuration based SPR chips.