Stress analysis of anodic bonded wafer after CMP process
| Main Authors: | Sim, Sung-min, Lee, Yeonsu, Kang, Hye-Lim, Hwang, Y.S., Park, C.H., Llamas-Garro, Ignacio, Kim, Jung-Mu |
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| Format: | Proceeding Journal |
| Bahasa: | eng |
| Terbitan: |
, 2017
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| Subjects: | |
| Online Access: |
https://zenodo.org/record/1002109 |
Internet
https://zenodo.org/record/1002109Lokasi
| Koleksi | Cognizance Journal of Multidisciplinary Studies |
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| Gedung | Cognizance Journal of Multidisciplinary Studies |
| Institusi | ZAIN Publications |
| Kota | Stockholm |
| Provinsi | INTERNASIONAL |
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