Fluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging
| Main Authors: | Ramdan, Dadan; Universitas Medan Area, Harahap, Usman; Universitas Medan Area, Rubiantara, Andi; Universitas Medan Area, Khor, Chu Yee; Universiti Malaysia Perlis (UniMAP) |
|---|---|
| Other Authors: | Universiti Sains Malaysia |
| Format: | Article info eJournal |
| Bahasa: | eng |
| Terbitan: |
Universitas Ahmad Dahlan
, 2016
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| Subjects: | |
| Online Access: |
http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/2030 |
Internet
http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/2030Lokasi
| Koleksi | Bulletin of Electrical Engineering and Informatics |
|---|---|
| Gedung | Perpustakaan Universitas Ahmad Dahlan |
| Institusi | Universitas Ahmad Dahlan |
| Kota | KOTA YOGYAKARTA |
| Provinsi | DAERAH ISTIMEWA YOGYAKARTA |
| Kontak | Butuh informasi lebih lanjut? Hubungi pustakawan institusi ini. |