3D Microelectronic Packaging
Main Authors: | Li, Yan, Goyal, Deepak |
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Other Authors: | Chun, Kukjin, Itoh, Kiyoo, Lee, Thomas H., Micheloni, Rino, Sakurai, Takayasu, Sansen, Willy M.C., Landsiedel, Doris Schmitt- |
Format: | Book PeerReviewed |
Terbitan: |
Springer International Publishing
, 2017
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Subjects: | |
Online Access: |
http://repository.unsri.ac.id/10702/ https://link.springer.com/book/10.1007/978-3-319-44586-1 |
Internet
http://repository.unsri.ac.id/10702/https://link.springer.com/book/10.1007/978-3-319-44586-1
Lokasi
Koleksi | Sriwijaya University Institutional Repository |
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Gedung | UPT Perpustakaan Universitas Sriwijaya |
Institusi | Universitas Sriwijaya |
Kota | OGAN ILIR |
Provinsi | SUMATERA SELATAN |
Kontak | Butuh informasi lebih lanjut? Hubungi pustakawan institusi ini. |