Lokasi: Measurements and Stochastic FEA with Application in Thermomechanical Characterization of Electronic Packages

Main Authors:	Bendaou, Omar; Mohammadia School of Engineers, ERD3M Laboratory, Ibn Sina Avenue, Rabat 10000, Bendaou, Othmane; Faculty of Sciences of Tetouan, MS2M Team, Sebta Avenue, Tetouan 93002, Bourzeix, François; MAScIR-Microelectronics, Design and Test Department, Mohamed El Jazouli Street, Rabat 10100, Agouzoul, Mohamed; Mohammadia School of Engineers, ERD3M Laboratory, Ibn Sina Avenue, Rabat 10000, El Hami, Abdelkhalak; National Institute of Applied Sciences of Rouen, LOFIMS Laboratory, 76801 Saint Etienne de Rouvray Cedex,
Format:	Article info application/pdf eJournal
Bahasa:	eng
Terbitan:	ITB Journal Publisher, LPPM ITB , 2016
Subjects:	BGA FEA microscope shadow moiré stochastic analysis warpage
Online Access:	http://journals.itb.ac.id/index.php/jets/article/view/2322 http://journals.itb.ac.id/index.php/jets/article/view/2322/1890 http://journals.itb.ac.id/index.php/jets/article/downloadSuppFile/2322/699

Koleksi	Journal of Engineering and Technological Sciences
Gedung	Perpustakaan Institut Teknologi Bandung
Institusi	Institut Teknologi Bandung
Kota	KOTA BANDUNG
Provinsi	JAWA BARAT
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