Utilization of polyproylene synthetic aggregate and epoxy resin for chip sealing
| Main Authors: | , YOGASWORO, Swadarma, , Dr. Ir. Latif Budi Suparma, M.Sc |
|---|---|
| Format: | Thesis NonPeerReviewed |
| Terbitan: |
[Yogyakarta] : Universitas Gadjah Mada
, 2009
|
| Subjects: | |
| Online Access: |
https://repository.ugm.ac.id/80614/ http://etd.ugm.ac.id/index.php?mod=penelitian_detail&sub=PenelitianDetail&act=view&typ=html&buku_id=41478 |
Internet
https://repository.ugm.ac.id/80614/http://etd.ugm.ac.id/index.php?mod=penelitian_detail&sub=PenelitianDetail&act=view&typ=html&buku_id=41478
Lokasi
| Koleksi | UGM Repository |
|---|---|
| Gedung | Perpustakaan Pusat Universitas Gadjah Mada |
| Institusi | Universitas Gadjah Mada |
| Kota | SLEMAN |
| Provinsi | DAERAH ISTIMEWA YOGYAKARTA |
| Kontak | Butuh informasi lebih lanjut? Hubungi pustakawan institusi ini. |